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| MC100EPT23 3.3V Dual Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator The MC100EPT23 is a dual differential LVPECL/LVDS/CML to LVTTL/LVCMOS translator. Because LVPECL (Positive ECL), LVDS, and positive CML input levels and LVTTL/LVCMOS output levels are used, only +3.3 V and ground are required. The small outline 8-lead SOIC package and the dual gate design of the EPT23 makes it ideal for applications which require the translation of a clock or data signal. The EPT23 is available in only the ECL 100K standard. Since there are no LVPECL outputs or an external VBB reference, the EPT23 does not require both ECL standard versions. The LVPECL/LVDS inputs are differential. Therefore, the MC100EPT23 can accept any standard differential LVPECL/LVDS input referenced from a VCC of +3.3 V. Features http://onsemi.com MARKING DIAGRAMS* 8 8 1 SOIC-8 D SUFFIX CASE 751 1 KPT23 ALYW G 8 8 1 TSSOP-8 DT SUFFIX CASE 948R 1 KA23 ALYWG G Pb-Free Packages are Available DFN8 MN SUFFIX CASE 506AA 1 A L Y W M G = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 1 December, 2006 - Rev. 15 Publication Order Number: MC100EPT23/D 3T M G G 4 * * * * * * 1.5 ns Typical Propagation Delay Maximum Operating Frequency > 275 MHz LVPECL/LVDS/CML Inputs, LVTTL/LVCMOS Outputs 24 mA LVTTL Outputs Operating Range: VCC = 3.0 V to 3.6 V with GND = 0 V MC100EPT23 Table 1. PIN DESCRIPTION D0 1 8 VCC Pin Q0, Q1 D0 2 LVPECL D1 3 LVTTL 6 Q1 7 Q0 D0**, D1** D0**, D1** VCC GND EP Function LVTTL/LVCMOS Outputs Differential LVPECL/LVDS/CML Inputs Positive Supply Ground Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. D1 4 5 GND ** Pins will default to VCC/2 when left open. (Top View) Figure 1. Logic Diagram and 8-Lead Pinout Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model Charged Device Model Value 50 kW 50 kW > 1500 V > 100 V > 2 kV Level 1 UL 94 V-0 @ 0.125 in 91 Devices Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Oxygen Index: 28 to 34 Table 3. MAXIMUM RATINGS Symbol VCC VI Iout TA Tstg qJA qJC qJA qJC qJA Tsol Power Supply Input Voltage Output Current Parameter Condition 1 GND = 0 V GND = 0 V Continuous Surge VI VCC Condition 2 Rating 3.8 3.8 50 100 -40 to +85 -65 to +150 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm <2 to 3 sec @ 248C <2 to 3 sec @ 260C SOIC-8 SOIC-8 SOIC-8 TSSOP-8 TSSOP-8 TSSOP-8 DFN8 DFN8 190 130 41 to 44 185 140 41 to 44 129 84 265 265 Unit V V mA mA C C C/W C/W C/W C/W C/W C/W C/W C/W C Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Wave Solder Pb Pb-Free Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC100EPT23 Table 4. PECL DC CHARACTERISTICS VCC = 3.3 V, GND = 0 V (Note 2) -40C Symbol ICCH ICCL VIH VIL VIHCMR IIH IIL Characteristic Power Supply Current (Outputs set to HIGH) Power Supply Current (Outputs set to LOW) Input HIGH Voltage Input LOW Voltage Input HIGH Voltage Common Mode Range (Note 3) Input HIGH Current Input LOW Current D D -150 -150 Min 10 15 2075 1355 1.2 Typ 18 26 Max 25 36 2420 1675 3.3 150 -150 -150 Min 10 15 2075 1355 1.2 25C Typ 18 26 Max 25 36 2420 1675 3.3 150 -150 -150 Min 10 15 2075 1355 1.2 85C Typ 18 26 Max 25 36 2420 1675 3.3 150 0.5 Unit mA mA mV mV V mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. All values vary 1:1 with VCC. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 5. LVTTL/LVCMOS OUTPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0.0 V, TA = -40C to 85C Symbol VOH VOL IOS Characteristic Output HIGH Voltage Output LOW Voltage Output Short Circuit Current Condition IOH = -3.0 mA IOL = 24 mA -180 Min 2.4 0.5 -50 Typ Max Unit V V mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 6. AC CHARACTERISTICS VCC = 3.0 V to 3.6 V, GND = 0.0 V (Note 4) -40C Symbol fmax tPLH, tPHL tSK+ + tSK- - tSKPP tJITTER VPP tr tf Characteristic Maximum Frequency (Figure 2) Propagation Delay to Output Differential (Note 5) Output-to-Output Skew++ Output-to-Output Skew-- Part-to-Part Skew (Note 6) Random Clock Jitter (RMS) (Figure 2) Input Voltage Swing (Differential Configuration) Output Rise/Fall Times (0.8 V - 2.0 V) Q, Q 150 330 Min 275 1.2 1.2 Typ 350 1.5 1.5 15 35 70 5 800 600 1.8 1.8 60 80 500 10 1200 900 150 330 Max Min 275 1.2 1.1 25C Typ 350 1.5 1.5 15 40 70 5 800 600 1.8 1.8 70 80 500 10 1200 900 150 330 Max Min 275 1.3 1.1 85C Typ 350 1.7 1.5 30 40 140 5 800 650 2.4 1.8 125 80 500 10 1200 900 Max Unit MHz ns ps ps mV ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Measured with a 750 mV 50% duty-cycle clock source. RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 3. 5. Reference (VCC = 3.3V 5%; GND = 0 V) 6. Skews are measured between outputs under identical conditions. http://onsemi.com 3 MC100EPT23 3.0 VOL 0.5 V VOH 12 RANDOM CLOCK JITTER (ps RMS) 2.0 VOH (V) 8 JITTER 1.0 4 0.0 0 100 200 FREQUENCY (MHz) 300 0 400 Figure 2. Typical VOH / Jitter versus Frequency (255C) APPLICATION TTL RECEIVER CHARACTERISTIC TEST *CL includes fixture capacitance CL* RL AC TEST LOAD GND Figure 3. TTL Output Loading Used for Device Evaluation http://onsemi.com 4 MC100EPT23 ORDERING INFORMATION Device MC100EPT23D MC100EPT23DG MC100EPT23DR2 MC100EPT23DR2G MC100EPT23DT MC100EPT23DTG MC100EPT23DTR2 MC100EPT23DTR2G MC100EPT23MNR4 MC100EPT23MNR4G Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) Shipping 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices http://onsemi.com 5 MC100EPT23 PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AH -X- A 8 5 B 1 4 S 0.25 (0.010) M Y M -Y- G C -Z- H D 0.25 (0.010) M SEATING PLANE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MC100EPT23 PACKAGE DIMENSIONS TSSOP-8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R-02 ISSUE A 8x K REF 0.10 (0.004) M 0.15 (0.006) T U S 2X TU S V S L/2 8 5 L 1 PIN 1 IDENT 4 B -U- 0.25 (0.010) M 0.15 (0.006) T U S A -V- F DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ C 0.10 (0.004) -T- SEATING PLANE D -W- G DETAIL E DIM A B C D F G K L M http://onsemi.com 7 MC100EPT23 PACKAGE DIMENSIONS DFN8 CASE 506AA-01 ISSUE D D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 --- 0.25 0.35 PIN ONE REFERENCE E 2X 0.10 C 2X 0.10 C TOP VIEW DIM A A1 A3 b D D2 E E2 e K L 0.10 C 8X 0.08 C SEATING PLANE A1 8X L K ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CCCC CCCC CCCC CCCC D2 e/2 1 8 A SIDE VIEW (A3) C e 4 E2 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW http://onsemi.com 8 MC100EPT23/D |
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